Datacom Systems D56 Specifiche Pagina 104

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Si5040
104 Rev. 1.3
16. Package Outline: Si5040
Figure 25 illustrates the package details for the Si5040. Table 14 lists the values for the dimensions shown in the
illustration.
Figure 25. 32-Pin Land Grid Array Package (LGA)
Table 14. Package Diagram Dimensions
Dimension Min Nom Max
A 0.75 0.85 0.95
b 0.27 0.30 0.33
c 1.00 1.10 1.20
D 5.00 BSC.
e 0.50 BSC.
E 5.00 BSC.
f 0.735 BSC.
g 0.735 BSC.
h 2.185 BSC.
j 2.185 BSC.
aaa 0.10
bbb 0.10
ccc 0.10
ddd 0.10
eee 0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
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